Plenary, Panel Sessions and Luncheon

5G Evolution and 6G

Mr. Takehiro Nakamura

Senior Vice President, General Manager of 5G Laboratories, NTT DOCOMO, INC.

Mr. Takehiro Nakamura joined NTT Labs. in 1990. He is now SVP and General Manager of 5G Labs. in NTT DOCOMO, INC.  Mr. Nakamura has been working for research and development of the W-CDMA, HSPA, LTE/LTE-Advanced, 5G and C-V2X/Connected Car technologies.  He has been engaged in the standardization activities for W-CDMA, HSPA, LTE/LTE-Advanced and 5G at ARIB in Japan since 1997.  He is currently the leader of 2020 and Beyond Ad Hoc (20B AH) in ARIB and Acting Chairman of the Strategy & Planning Committee in 5G Mobile Communication Promotion Forum (5GMF) in Japan.  He has been contributing to standardization activities in 3GPP since 1999.  He contributed to 3GPP TSG-RAN as a vice chairman from March 2005 to March 2009 and as a chairman from April 2009 to March 2013.  He is also very active in standardization of C-V2X/Connected Car in ARIB and ITS Info-communications Forum in Japan.   He is now a leader of Cellular System Application Task Group of ITS Info-communications Forum.

The Future of Compute: How the Data Transformation is Reshaping VLSI

Dr. Michael C. Mayberry

Chief Technology Officer at Intel Corporation

Dr. Michael C. Mayberry is the Chief Technology Officer at Intel Corporation. He is a Senior Vice-President, and General Manager of Technology Development where he is responsible for the research, development and deployment of next-generation silicon logic, packaging and test technologies that will produce future Intel products.

Since joining Intel in 1984 as a process integration engineer, Mayberry has held a variety of positions. As part of the California Technology Development team, he developed EPROM, flash and logic wafer fabrication processes. In 1994, he moved to Sort Test Technology Development, responsible for road maps and development of test processes for Intel microprocessors. In 2005, he moved to Components Research and was responsible for research to enable future process options for Intel’s technology development organizations. In 2015, he moved to Intel Labs and became responsible for Intel’s product-driven research. In 2018, he moved to the Technology Development group at Intel.
Mayberry received his bachelor’s degree in chemistry and mathematics from Midland College and his PhD in physical chemistry from the University of California, Berkeley.

Silicon is Greener: Why Innovation in Circuits is Needed for Sustainability

Jen Lloyd

Vice President for the Precision Technology and Platforms Group, ADI

Jen Lloyd received S.B., S.M., and Ph.D. degrees in EECS from the Massachusetts Institute of Technology. She started her career as an analog designer at Analog Devices in the High-Speed Converter group, and has contributed to various ADC, DAC and SerDes products for which she holds 9 US patents and several papers and publications. She served on the technical program committee for both the IEEE Custom Integrated Circuits Conference and the IEEE Symposium on VLSI Circuits.  Jen led ADI’s core technology business in amplifiers and precision converters, along with the Instrumentation Market Group.   For several years she was Vice President, Healthcare and Consumer Systems, where she led global engineering and business teams to build innovative solutions for those markets, which were discussed in a presentation at ISSCC in 2019.  Dr. Lloyd is now Vice President for the Precision Technology and Platforms Group, in which she drives technology and market leadership across ADI’s precision franchises and related solutions in high-speed and precision amplifiers, precision converters, references, switches and isolation.  Jen is passionate about supporting women in our field through forums including IEEE Women in Circuits.

Empowering Next-Generation Applications through FLASH Innovation

Shigeo (Jeff) Ohshima

Technology Executive, SSD Development and Application Engineering, KIOXIA

  • Jeff Ohshima is a member of the technology executive team at KIOXIA, formerly Toshiba Memory Corporation, that started operation under its new corporate identity as of October 1st 2019.
  • Currently he focuses on SSD development and application engineering.
  • He was previously VP Memory Technology Executive at Toshiba America Electronic Components, currently Kioxia America, Inc., focused on flash memory with an emphasis on SSDs.
  • He was also Senior Manager R&D in the advanced NAND flash memory design department, responsible for 70 nm, 56 nm, 43 nm, and 32 nm design. He has been engaged with memory technology for over 30 years, including 20 years on DRAM where he acted as a design lead for application specific memories and did technical marketing.
  • He has served as the keynote speaker for Flash Memory Summit, held in every August in Santa Clara, CA for five consecutive years and has been back to back rated as the best keynote.
  • Ohshima has served as a Visiting Research Scientist at Stanford University in 1992-93.