Panel Sessions

Organizers (JFE): Hiroshi Morioka, Socionext Inc.
Organizers (JFE): Takashi Tokuda, Tokyo Institute of Technology
Organizers (NAE): Peide Ye, Purdue Univ.
Organizers (NAE): John Wuu, Advanced Micro Devices

Technology Panel

3D/Heterogeneous integration: Are we running towards a Thermal Crisis?


Takayuki Ohba, Tokyo Institute of Technology

Although 3DI including 2.5D system has many benefits in terms of performance and size reduction, it is unavoidable to provide thermal management without sacrifying reliability. Thermal management has been conducted many decades, since semiconductors started. Now the industry is facing serious limitations due to increasing density of 3DI in the computer system.
• Thermal management trends toward high density 3DI
• How to cool high power 2.5D and 3D systems?
• How to optimize performance and size vs cooling in the mobile phone?
• Future trends on Hot Supercomputer
• What leads to Thermal Crisis?
• Limitation of Air cooling and Liquid cooling

Live Session: June 17, 8:00AM-9:00AM (JST)


Ravi Mahajan, Intel Fellow
Victor Adrian Chiriac, GCTG LLC (Former Qualcomm)
Hiroyuki Ryoson, Dexerials
Kuo-Chung Yee, TSMC

Circuits Panel

New Generation Chip Makers vs. the Incumbents


Naveen Verma, Princeton University

The world needs silicon more than ever! This is largely because the applications where sensing, computing, and communication chips are needed is broader than ever, encompassing healthcare, scientific discovery, automotive/transportation, industrial automation, and beyond. Silicon provides specific and critical enablement and differentiation in these applications, through the systems they are built on. This has already driven a change in the ecosystem, where system companies have embraced in-house silicon development. What does this trend mean for silicon innovation and impact, and where might this trend lead us? Is this a renaissance moment, or is it opening up dual/multiple tracks for silicon innovation? What are the differences in the innovation culture across these tracks? What types of innovators are needed to thrive in and maximize the impact of these tracks? How does all of this relate to constraints in the silicon supply chain? This panel brings together innovators across the emerging tracks to provide insights and counter viewpoints – some you would have expected and others you need the insider’s views to appreciate.

Live Session: June 17, 7:00AM-8:30AM (JST)


Joe Macri, AMD
Jean-Francois Vidon, Qualcomm
Ganesh Venkataramanan, Tesla
Don Stark, Google
Yusuke Doi, Preferred Networks

Joint Panel

The New Normal… How will it Change Work, Life and Education?


Kazuo Yano, Hitachi

This pandemic changes our minds and behaviors, and changes our lives, work, and education. In this panel, a variety of leading experts from Zen Buddhism, wellbeing science, computer-human interfaces, to media art will join to deepen the meaning of this irreversible change and discuss the changing role of technology.

Live Session: June 18, 7:30AM-8:30AM (JST)


Joseph A. Paradiso, MIT Media Lab
Takafumi Zenryu Kawakami, Shunkoin in Myoshinji Temple
Junichi Rekimoto, The University of Tokyo / Sony Computer Science Laboratories, Inc.
Alden Lai, New York University