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Workshop on Impact of Atomic Layer Processing and Selective Area Patterning on Device Fabrication and Performance

Organizer:
Eric A. Joseph (IBM Research, USA)

Committee:
Gottlieb Oehrlein – University of Maryland
Craig Huffman – Micron
Dennis Hausmann – LAM Research
Sumit Agarwal – Colorado School of Mines

Abstract / objectives:
The workshop is going to highlight new capability in the field of Atomic Layer Etching, Atomic Layer Deposition and Selective Area Patterning which are of interest to the semiconductor device community for the enablement of future device fabrication technology.

Tittle Speaker
Organization
Time
Session 1 Effect of ALE on Semiconductor Device Properties Geun-Young Yeom
Sungkyunkwan Univ.
19:00
Surface Reaction Analyses for Atomic Scale Processing by Beam Experiments Kazuhiro Karahashi
Osaka Univ.
19:25
Selective and Self-Limited Thin Film Processes for the Atomic Scale Era Rob Clark
TEL
19:50
15 minutes Break 20:15
Session 2 Plasma-Based Selective Atomic Layer Deposition and Etching to Enable 5nm and Beyond Device Technology Erwin Kessels
Eindhoven Univ. of Tech.
20:30
Selective Deposition: The Devil is in the Defects Hui Jae Yoo
Intel
20:55
Creating 3D Nanoscale Structures by Area-Selective Deposition Annelies Delabie
KU Leuven / imec
21:20